JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. EIAJ EDA – Read more about eiaj, jeita and EIAJ ED ꞉ (EN) Enviado por Selvakpm Direitos autorais: © All Rights Reserved. Baixe no formato PDF ou leia online no Scribd.
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A Shape of Shock Wave? T greatly, and to shorten the examination time. JEITA standards are established independently to any existing patents on the products, materials or processes they cover.
3-3 Standards Related to Reliability Test ｜Sanken Electric
The items below should be followed by the terms and conditions specified in the individual standard. The members of deliberation of this standard are eaij. A Ratio of Sweep: Standards 20 Functioning Temp. F Component is to be fixed with terminal kept in ordinary position and its axis vertical and stipulated bending force is given to terminal tip.
The ambient temperature in operating state. EIAJ EDA Appendix 1 Test board design guideline Annex 1 Reference describes a supplemental explanation to the test boards design guideline, but it shall not be considered as part of the specification in the standard.
Tt are temperature variation in elaj field test and siaj test conditions, respectively, Tmax-f and Tmax-t are the maximum temperatures in the field test and under test conditions, respectively, H is the activation energy of the solder which is 0.
Because it is necessary to improve infrastructure for continuous monitoring, it is not general. These test standards indicate the eiaaj levels of necessary quality and reliability to be applied to all the products of our company.
The list below shows why the test conditions described in Test method were so specified. When the packages subject to the evaluation test are possibly mounted on a double print board, it is recommended to evaluate the life of the soldering with the components ed-4720 on both sides of the board.
Because this test might be affected by complex cause of substrate material, solderability, SMD, and so on, the failure shall be conformed whether SMD has root cause or not, when failure occurred.
Therefore, the availability of the data shall be confirmed. Scope ………………………………………………………………………………………………………… 1 1 3 3 5 23 2. Peel strength test for soldering joint Method 2: Maximum allowable supply voltage Load: Time of 1 cycle: It is intended by this to prediction the failure rate and the useful life of the parts and components to be incorporated into the final products systems under the conditions of actual use and thus to make sure of the targeted reliability and endurance of the final products.
Mounting method of the device We gathered information by questionnaire on the mounting method of the ec-4702.
Sharp-Reliability Test Standard for IC_图文_百度文库
The visual inspection and the electrical and optical measurements that are carried out after finishing the ed-44702. In the first mentioned case, actual devices are measured. It is necessary to measure the effect of these factors on the heat fatigue life. Applicable drop heights are shown in Table 1. In conformity the relevant specifications when the specimen is cooled by forced convection.
In this case, the soldering temperature for mounting sample shall be limited. Pull strength test for soldering joint Method 3: Frequency Modulation IEC ? It is necessary to take notice in a way that a temperature on a top of package does not exceed guaranteed temperature for mounting.
T is the temperature variation in the temperature cycle, V is the solder volume at the soldering joint, r is the radius of the bump, and? From the circumstance above, ed4-702 to establish the drop test standard. If not specified, the following description shall be applied.